System-in-Package (SiP) Manufacturing

Updated: 3/27/2026

SiP production requires micrometer accuracy and material-specific processes. Main challenges:

• Micro-via formation
  • Diameters from a few microns to ~200 µm.
  • Chemical etching works for silicon and some glass, but not for many ceramics or organic laminates.
  • Etching adds waste, steps, and cost.
• Material cutting and singulation
  • Requires low collateral damage and tight kerf control as feature sizes shrink.
• Thin-material handling
  • Non-contact processing reduces mechanical damage and increases yield.
• Material diversity
  • Ceramics, ABF, FR4, glass, laminates with embedded copper traces respond differently to mechanical saws, etching, and lasers.

Shorter wavelengths and shorter pulse widths reduce the heat-affected zone, improving precision and yield.

Typical uses by wavelength:

• UV: micro-vias in ceramic, organic, glass interposers.
• UV and green: ceramic interposer cutting, depaneling, silicon scribing/dicing.
• IR: glass cutting.

IceFyre^® Picosecond Lasers: Spectra-Physics IceFyre picosecond lasers set a new standard for picosecond micromachining and can provide the ultimate solutions for SiP manufacturing. The UV version enables premium quality drilling of micro-vias through ceramic, organic and glass interposers. Both the UV and green versions are great for cutting ceramic interposers, depaneling and scribing and dicing silicon dies. Additionally, the IR version can be used to cut glass interposers.

	IceFyre®
Wavelengths	UV	Green	IR
Power	Up to >50 W
Pulse Width	<12 ps	<15 ps
Repetition Rates	Single Shot to 10 MHz
Max Pulse Energy	Up to >40 µJ	Up to >60 µJ	Up to >200 µJ

Use cases: high-throughput micro-via drilling, interposer cutting, depaneling, scribing/dicing.

• Talon^® Ace™ Lasers: Delivering an industry-leading >100 Watts of UV power, Talon Ace offers the lowest cost-per-Watt and cost of ownership for high power nanosecond UV lasers. This laser can be employed for a whole host of applications including drilling micro-vias through ceramic, organic laminate and glass interposers, cutting ceramic and organic laminate interposers, depaneling, and scribing and dicing dies. Talon Ace also includes our proprietary TimeShift programmable burst-mode technology for the most versatile pulse control, leading to increased process speed and quality.
• Talon^® Nanosecond Lasers: For the best combination of performance, reliability and cost in SiP laser manufacturing, Spectra-Physics Talon lasers deliver excellent results. Talon works exceptionally well for cutting ceramic and organic laminate interposers, depaneling and scribing and dicing silicon dies. The UV version in particular is also able to drill micro-vias through ceramic and organic interposers. The Talon provides high quality results, but its cuts and drills may not be as pristine as the IceFyre’s. Talon’s advantage over IceFyre, though, is that it can cut and drill faster.
• Quasar^® High-Power Nanosecond Lasers: Other lasers highly suited for SiP manufacturing are the Spectra-Physics Quasar^® and Talon^® Ace nanosecond series of lasers. The Talon Ace UV100 is the highest-powered single mode UV laser in the industry, so it delivers fast micromachining and provides 24/7 industrial reliability. Like the IceFyre and Talon, the UV and green versions of the Quasar and Talon Ace can also be used for depaneling, scribing and dicing dies. And like the UV version of the IceFyre, the Quasar UV and Talon Ace UV can also drill micro-vias through ceramic, organic and glass interposers.

	Talon Ace	Talon	Quasar
Wavelengths	UV	UV or Green	UV or Green
Power	>100 W	UV: Up to >45 W Green: Up to >40 W	UV: Up to >80 W Green: Up to >95 W
Pulse Width	<2 to >50 ns	UV: <25 or 40 ns Green: <25 ns	<2 to >100 ns
Repetition Rates	Single shot to 5 MHz	0 to 500 kHz	0 to 3.5 MHz
Max Pulse Energy	Up to >500 µJ	UV: Up to >500 µJ Green: Up to 1000 µJ	UV: Up to >400 µJ Green: Up to >475 µJ

Presented here is a summary of recommended MKS lasers for various SiP manufacturing applications. Please use this as a reference guide only, and always contact us to discuss your application and requirements in detail so that we may provide the best solution for you.

* Dicing thin wafers < 100 µm

Lasers and optics degrade from thermal effects, contamination, and vibration. Regular monitoring prevents process drift and downtime.

Laser Power Sensors

MKS offers a comprehensive portfolio of Ophir^® laser thermal power sensors for pulsed and ultrashort lasers with high damage thresholds and ISO/IEC 17025 calibration. 

	F150(200)A-CM-16	30(150)A-SV-17	F80(120)A-CM-17
Spectral Range	0.248-9.4 µm	0.19-11 µm	0.248-9.4 µm
Power Range	300 mW - 200 W	100 mW - 150 W	100 mW - 120 W
Energy Range	50 mJ – 200 J	50 mJ – 300 J	50 mJ – 200 J
Max Avg Power Density	35 kW/cm2	60 kW/cm2	35 kW/cm2
Max Energy Density (2 msec)	45 J/cm2	50 J/cm2	45 J/cm2
Aperture	Ø16 mm	Ø17 mm	Ø17.5 mm
Response Time	3 sec	1.7 sec	2 sec

IDL-LM Series
Travel Range	100 to 1200 mm
Speed	2000 mm/s
Load Capacity	450 to 2,000 N
Accuracy	±2 to ±5 µm
Repeatability	±0.25 to ±0.5 µm
Pitch	±15 to ±65 µrad
Yaw	±15 to ±40 µrad

Multi-axis controllers synchronize galvos and stages, provide extensive I/O, and support complex trajectories for industrial production.

XPS-D	XPS-RLD
High performance, complex motion trajectories Up to 8 axes Extensive analog and digital I/O Can synchronize galvos and positioners Best for the most demanding applications	High performance, complex motion trajectories Up to 4 axes Analog and digital I/O Can synchronize galvos and positioners Good for demanding R&D and low volume production

High-Energy Laser Optics